DDR3 SDRAM Product Guide

October 2009

Memory Division

October 2009

K 4 B X X X X X X X - X X X X

SAMSUNG Memory

DRAM

DRAM Type

Density

Bit Organization

1.SAMSUNG Memory : K

2.DRAM : 4

3.DRAM Type

B: DDR3 SDRAM

4.Density

51 : 512Mb

1G : 1Gb

2G : 2Gb

4G : 4Gb

5. Bit Organization

04 : x 4

08 : x 8

16 : x16

6. # of Internal Banks

3: 4 Banks

4: 8 Banks

5: 16 Banks

Speed

Temp & Power

Package Type

Revision

Interface (VDD, VDDQ)

# of Internal Banks

7.Interface ( VDD, VDDQ)

6 : SSTL (1.5V, 1.5V)

8.Revision

M: 1st Gen.

A: 2nd Gen.

B: 3rd Gen.

C: 4th Gen.

D: 5th Gen.

E: 6th Gen.

F: 7th Gen

G: 8th Gen

H: 9th Gen

9.Package Type

Z: FBGA (Lead-free)

H : FBGA (Halogen-free & Lead-free)

J : FBGA (Lead-free, DDP)

M: FBGA (Halogen-free & Lead-free, DDP)

10.Temp & Power

C : Commercial Temp.( 0??C ~ 85??C) & Normal Power

L : Commercial Temp.( 0??C ~ 85??C) & Low Power

Y : Commercial Temp.( 0??C ~ 85??C) & Low VDD(1.35V)

11.Speed

F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

October 2009

* Note : 1.35V product is 1.5V operatable.

October 2009

M X X X B X X X X X X X - X X X

Memory Module

DIMM Type

3: x 8

4: x16

October 2009

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM

* Note : 1.35V product is 1.5V operatable.

October 2009

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM

* Note : 1.35V product is 1.5V operatable.

October 2009

October 2009

* Note : 1.35V product is 1.5V operatable.

October 2009

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)

240Pin DDR3 VLP Registered DIMM

October 2009

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

240Pin DDR3 VLP Registered DIMM

* Note : 1.35V product is 1.5V operatable.

October 2009

5. RDIMM RCD Information

5.1RCD Identification in JEDEC Description in Module Label

5.2Label Example

4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0

Made inKorea M393B5170EH1-CH9 0920

5.3RCD Information

- Example

October 2009

78 + 4Ball FBGA for 1Gb D-die (x4/x8)

October 2009

October 2009

96Ball FBGA for 2Gb B-die (x16)

October 2009

78Ball DDP for 1Gb D-die (x4)

A

B

C

(Datum B) D

E

F

G

H

J

K

L

M

N

82 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)

0.2 A B

0.35 ?? 0.05

1.40 ?? 0.10

78Ball DDP for 1Gb E-die (x4/x8)

A

B

C

(Datum B) D

E

F

G

H

J

K

L

M

N

78 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)

0.2 M A B

0.35 ?? 0.05

1.40 ?? 0.10

October 2009

78Ball DDP for 2Gb B-die (x4/x8)

A

B

C

(Datum B) D

E

F

G

H

J

K

L

M

N

78 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)

0.2 A B

0.35 ?? 0.05

1.40 ?? 0.10

October 2009

x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

N/A

(for x64)

ECC

(for x72)

1.270 ?? 0.10

5.00

3.80

1.50??0.10

2.50

Detail A

2.50 ?? 0.20

0.2 ?? 0.15

1.00

Detail B

October 2009

x64 204pin DDR3 SDRAM Unbuffered SODIMM

Units : Millimeters

1.00 ?? 0.10

2X 4.00 ?? 0.10

0.10 C A B

October 2009

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters

5.00 0.20 ??2.50

0.80 ?? 0.05

0.2 ?? 0.15

10.9 0.4

Detail C

2x 2.10 ?? 0.15

Register

Address, Command and Control lines

October 2009

Inside

0.4

Green Line : TIM Attatch Line

Reg. pedestal line

7.45

2. BACK PART

Outside

October 2009

4. DDR3 RDIMM ASS???Y View

Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

132.95 ?? 133.45

19 ?? 0.1

* Dimension Index

October 2009