Philips_Car_Amplifier

24 W BTL or 2 x 12 W stereo car radio

power ampli???er

TDA1510AQ

GENERAL DESCRIPTION

The TDA1510AQ is a class-B integrated output amplifier encapsulated in a 13-lead single in-line (SlL) plastic power package. Developed primarily for car radio application, the device can also be used to drive low impedance loads (down to 1,6 ??). With a supply voltage (VP) of 14,4 V, an output power of 24 W can be delivered into a 4 ?? Bridge Tied Load (BTL), or when used as a stereo amplifier, 2 ?? 12 W into 2 ?? or 2 ?? 7 W into 4 ??.

QUICK REFERENCE DATA

PACKAGE OUTLINE

TDA1510AQ: 13-lead SIL-bent-to-DIL; plastic power (SOT 141C); SOT141-6; 1996 Aug 01.

24 W BTL or 2 x 12 W stereo car radio

power ampli???er

TDA1510AQ

HEATSINK DESIGN EXAMPLE

The derating of the encapsulation requires the following external heatsink (for sine-wave drive): (Rth j-mb) = 3,5 K/W

24 W BTL (4 ??) or 2 ?? 12 W stereo (2 ??); maximum sine-wave dissipation = 12 W;

Tamb = 65 ??C (maximum):

2 ?? 7 W stereo (4 ??); maximum sine-wave dissipation = 6 W; Tamb = 65 ??C (maximum):

24 W BTL or 2 x 12 W stereo car radio

power ampli???er

TDA1510AQ

Notes to the characteristics

1.If V11 > V10 then I11 must be < 10 mA.

2.Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.

3.Frequency response externally fixed.

4.The input impedance in the test circuit (Fig.3) is typ. 100 k??.

5.Supply voltage ripple rejection measured with a source impedance of 0 ?? (maximum ripple amplitude 2 V).

6.Output power is measured directly at the output pins of the IC.

7.Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.

8.A resistor of 56 k?? between pins 3 and 7 is required for symmetrical clipping.

9.Without bootstrap the 100 ??F capacitor between pins 5 and 6 and the 100 ??F capacitor between pins 8 and 9 can be omitted. Pins 6 and 8 connected to pin 10.

24 W BTL or 2 x 12 W stereo car radio

power ampli???er

TDA1510AQ

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our ???IC Package Databook??? (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 ??C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 ??C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 ??C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speci???cation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speci???cation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.