1. Safety Precautions

1-1. Repair Precaution

???Repair in Shield Box, during detailed tuning. Take specially care of tuning or test,

because specipicty of cellular phone is sensitive for surrounding interference(RF noise).

???Be careful to use a kind of magnetic object or tool,

because performance of parts is damaged by the influence of manetic force.

???Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away.

???Use a thicken twisted wire when you measure level.

A thicken twisted wire has low resistance, therefore error of measurement is few.

???Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on.

???Take specially care of soldering, because Land of PCB is small and weak in heat.

???Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembing charger.

???Don't use as you pleases after change other material than replacement registered on SEC System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity.

???Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist.

???Use earthed soldering steel when you connect or disconnect ESD.

???Use soldering removing tool to break static electricity. otherwise ESD will be damaged by static electricity.

???Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity.

???You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.

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2. General Introduction

The SGH-T519 Quad Band phone functions as digital phone working in GSM (Global System for Mobile communications)850,EGSM900, DCS1800 and PCS(PersonalCommunication System)1900 modes.

<Specification>

<GPRS/EGPRS Factor>

???Coding scheme : CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support

???WAP 2.0 Browser

???SIM AT(Application Toolkit)

???40 Polyphonic Ringtone

<Basic Package >

???Handset + Standard Battery + TA + User Guide + Handstrap

<Option Item >

???Travel Adapter

???Ear Microphone

???Bluetooth Headset

???Bluetooth Hands Free Kit

???Car Charger/Adapter

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3. Specification

3-1. GSM General Specification

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Specification

3-2. GSM TX power class

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Specification

3-3. EDGE TX Power Level

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4. Product Function

Main Function

-1.3 Megapixel Camera and Camcorder -Bluetooth?? Wireless Technology -Instant Messageing capability -Multimedia capability

-Fun & Apps featureprovides My Files, music player, games,

alarms, calendar, task list, calculator, world time, unit conversion, timer, and stopwatch.

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5.Circuit Description

<RF Circuit Description of SGH-T519 >

1.FEM (F100)

==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900 controlled by logic.

Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters.

To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific frequency band.

-for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz

-for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz

-for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz

-for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz

2.FEM Control Logic

==> Truth Table

3.VC-TCXO(TCX400)

==> To generate the 26 MHz reference clock to drive the logic and RF.

4.SKY74137 (UCD100)

==> The sky74137 is a RF tranceiver IC for GS850, EGSM900 DCS1800

and PCS1900 quardband cellular systems, and incorporates EDGE tranceiver capabillity, and integrates most of the low power silicon functions of a tranceiver. The receive path implements a direct downconversion architecture. The transceiver consists of four integrated Low Noise Amplifiers (LNAs), a quadrature demodulator, selectable baseband filter bandwidths, and lowdroop DC Offset Correction (DCOC) sequencer.

- RX Function

Four LNAs which support different bands of operation have separated differential inputs. The LNA outputs feed into a quadrature demodulator that down-converts the RF signals directly to baseband. The baseband I and Q paths consist of cascaded amplifiers and low pass filter sections. All baseband filtering is provided on-chip using no external capacitors.

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Circuit Description

- TX Function

The device implements Skyworks Polar Loop transmit architecture. This architecture autonomously splits the amplitude and phase within the device using the traditional analog In-Phase and Quadrature (I/Q) signals. The filter-saving advantage of the translation-loop approach is embedded in the architecture. Also included is an AM loop that provides both signal AM and power level control. The transmitter is provided a coupled feedback signal from the PA and downconverts it to an IF. Following an IF VGA, this feedback signal is fed to both loops. The reference for both loops is a transmit IF signal produced by an I/Q modulator

5. POWER AMP (PAM400)

The module consists of a EGSM850/900 PA block and a DCS1800/PCS1900 PA block, Both PA blocks share common power supply pins to distribute current. The subsystem consists of two parts : a Power Amplifier Control (PAC) block, and an Integrated Coupler. To select GSM900/850 and GMS1800/1900 as determined from the Band Select (BAND_SEL) signal. SKY77331 contains band select switching circuitry to select GSM (BAND_SEL is low) and DCS/PCS (BAND_SEL is HIGH) as determined from the Band Select (BAND_SEL) signal. The BAND_SEL pad selects the PA output (DPCS_OUT or GSM_OUT) while the Power Control (VPC) controls the level of output power. The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.

< Baseband Circuit description of SGH-D407 >

1. CSP2750 (UCD301)

==> The CSP2750 has two major logical components power management and conversion signal processing.

The PSC component is responsible for all power-related functionality, including the following;

???Power management for RF, BB and ancillary devices within the GSM/GPRS

???Battery-charge management

???Reset control

???SIM card voltage-level shifting

The CSP component is responsible for the following ;

???Intraframe event scheduling

???Voice band processing, including voice band ADC and DAC

???Analog baseband processing, including baseband ADC and DAC

???Providing RF interface for Trident digital baseband device

???Transmitter Power control

???Automatic frequency control

???A5 ciphering

???Low-power sleep mode and wake-up control

5-2

The CSP2750 has the following major physical components;

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Circuit Description

???Timing and control unit

???RF serial interface

???Low-power sleep mode controller

???Baseband Transmitter / Receiver

???Voice input and output

2.WM8955L(UCD401)

==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone and loudspwaker amplifiers, designed to reduce external component requirements in portable digital audio application.

The on-chip headsphone amplifiers can deliver 40mW into a 16??? load. Advanced on-chip digital signal processing performs bass and treble tone comtrol.

The WM8955L can operate as a master or a slave, and include an on-chip PLL. It can use most master clock frequencies commonly found in portable systems, including USB,GSM, CDMA or PDC clocks, or standard 256fs, clock rates. Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are supported.

The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the digital core can operates on a separate supply down to 1.42V, saving power. Different section of the chip can also be powered down under software control.

3. HPE(UCP201)

==> The Trident-HPE digital baseband processor is a complete system IC designed for wireless terminals that includes two digital signal processor(DSP) cores optimized for low-power communications applications and a powerful, highperformance,

industry-standard microcontroller core along with a rich set of peripherals.

The Trident-HPE digital baseband processor achieves best-in-class signal processing performance while maintaining the efficient software code density, low power consumption, and small physical size required for GSM/GPRS terminals

ARM946E-S microcontroller core;

??? 101 MHz system bus, 16 kbyte instruction and 16kbyte data caches.

??? 8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero wait- state data memory

??? direct memory access controller for transparent transfer between memory and peripherals.

??? External Memory interface with asynchronous burst mode support

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Circuit Description

???Synchronous serial port supporting

???Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval timer and real-time clock.

???SD/MMC controller that supports interfacing to secure digital/multimedia memory card. Two DSP16000 dual-MAC DSP cores;??? Up to 404 million MACs per second at 101 MHz.

???Memory complement;

-DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM.

-DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM.

JTAG boundary scan and integrated H/W developement system Low power;

???Ultralow leakage process technology for best-in-class standby power

???Flexible power management modes to allow for maximum active power management Interprocessor communication hardware support between ARM, DSP0 and DSP1.

Supported by Trident-HPE digital baseband processor software and hardware developement tools as well as industry standard ARM software and hardware developement tools Two on-chip, programmable, PLL clock synthesizers;

- one for ARM and DSP, the other one for USB.

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6. Test Command & Test Procedure

6-1. Calibration Equipment

-HP 8960

-DC Power Supply

-Test Jig

-Configuration

DC POWER SUPPLY

GPIB

6-2. Calibration Program

- Samsung internal software

6-1

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Test Command & Test Procedure

6-3. Tx Power Tune up Procedure

- GMSK

1)Procedure:

a.Calibraion equipment HP8960 and the cell phone are connected through RF cable.

b.Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 5 level is 32.5 dBm).

c.Activate phone in Tx_Mode_Only.

d.HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program.

e.The program compares measured power with the target power.

f.The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone.

2)Target value is defined according to the value of GSM specification. See the TX power level definition table below.

3)Target values of the peak level of the phone are set normally in conducted mode

- GSM850 5 level : 32.5dBm

- EGSM900 5 level : 32.5dBm

- DCS 0 level : 29.5dBm

- PCS 0 level : 29.5dBm (Tolerance : -2dB ~ +1dB )

4)Accuracy

All the TX level from the phone after tuned-up satisfy the GSM specification

5) TX ramp mask specification applied to the calibration program :

6-2

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Test Command & Test Procedure

- 8PSK

1) Procedure:

a. Calibraion equipment HP8960 and the cell phone are connected through RF cable.

b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 8 level is 27 dBm).

c. Activate phone in Cont_8psk_Tx_Mode_Only.

d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program.

e. The program compares measured power with the target power. f. The calibration program decides power code which is defined in

advance in the program and writes the codes to the flash memory in the phone.

2) Target value is defined according to the value of EGPRS specification.

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Test Command & Test Procedure

See the TX power level definition table below.

3)Target values of the peak level of the phone are set normally in conducted mode

-GSM850 8 level : 27dBm

-EGSM900 8 level : 27dBm

-DCS 2 level : 26dBm

-PCS 2 level : 26dBm (Tolerance : -2dB ~ +1dB )

4)Accuracy

All the TX level from the phone after tuned-up satisfy the EGPRS specification

5) TX ramp mask specification applied to the calibration program :

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7. Array course control

Test Jig (GH80-03307A)

Test Cable (GH39-00478A)

RF Test Cable (GH39-00397A)

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Array course control

Software Downloading

7-1. Downloading Binary Files

???Two binary files for downloading T519.

???T519XXYY.s3 : Main source code binary.

7-2. Pre-requsite for Downloading

???Downloader Program(OptiFlash.exe)

???T519 Mobile Phone

???Data Cable

???Binary files

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Array course control

7-3. S/W Downloader Program

1. Load the binary download program by executing the ???OptiFlash.exe???

2.Select the ???Options??? -> ???Settings??? -> ???Generic??? -> ???Specify hardware platform???.

Choose hardware platform for the downloader file setting.

Set the everything else as the default values which are shown below

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Array course control

3. Select the COM port when the download cable is connected

Up to 64 ports are supported. Additionally you can select the maximum transfer speed OptiFlash will use to communicate with the phone. However, OptiFlash will use a slower speed if either the PC???s or the phone???s serial hardware is incapable of handling the selected speed.

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Array course control

4.Select the???Flash&Verify??? -> ???Browse???

Set the directory path and choose the latest s/w binary, for example ???T519XXYY.s3???, for the downloader binary setting.

In case of D407 the reserved regions are not a necessity. (It is defined in platform.def file)

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Array course control

5.Click ???OK??? button then press ???Flash???.

(Before pressing ???Flash??? button, push the button ???*???and ???END??? at the same time. Then press ???Flash???.)

Downloader will upload the binary file as below for the downloading.

6.When downloading is finished successfully, there is a ???All is well??? message.

7.After finishing downloading, Certain memory resets should be done to guarantee the normal performance.

8.Confirm the downloaded version name and etc. :

*#1234#

Full Reset :

*2767*3855#

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8. Exploded View and its Partslist

8-1. Cellular phone Exploded View

8-3

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Exploded view and its Part list

8-2. Cellular phone Parts list

8-2

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Exploded view and its Part list

8-3

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Disassembly and Assembly instructions

8-3. Disassembly

8-4

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Disassembly and Assembly instructions

7

1. Detach a LCD from LCD braket.

??? caution

1.Be careful not to do damage and scratch the phone.

8-5

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Disassembly and Assembly instructions

8-4. Assembly

3

1. Attach a SPK_MOT FPCB 2. Place a SPK_MOT FPCB

A.Connect SPK and MOT with FPCB and paste another FPBC along the baseline.

B.Place SPK_MOT F-PCB inside intenna.

8-6

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Disassembly and Assembly instructions

4

A.Place a LCD inserting LCD connector on the front of CARRIER LOWER. B.Place a LCD into place hole of CARRIER LOWER correctly.

C.Press carefully the top (SAMSUNG logo) and bottom( T-Mobile logo) of LCD .

D.Attach a LCD sponge to CARRIER LOWER along the base line (the right side and bottom)

5

1. Soler side keys and stick a friction tape

A.Solder side keys with soldering jig.

B.Stick a friction tape along the baseline.

8-5

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Disassembly and Assembly instructions

Press the connector horizontally to a

PBA

A.Press carefully the top of PBA with your right hand grasping CARRIER LOWER with your left hand.

B.Press both sides of PBA until it clicks into the CARRIER LOWER. (Grasp the edge of LCD during work)

C.Press the LCD connector to the CARRIER LOWER horizontally.

A.Press the intenna until it clicks into the PBA

B.Put the SPK CONNECTER horizontally

C.Place the soldering part of INTENNA to a groove

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Disassembly and Assembly instructions

8

A.Solder the intenna with soldering jig

B.Place the camera into a groove of CARRIER LOWER.

C.Press carefully after placing camera module.

9

1.Place the PBA side keys

A.Place the PBA on the FRONT.

B.Remove the camera protection film.

C.Place side keys into place.

8-5

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Disassembly and Assembly instructions

8-6

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9. MAIN Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

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Electrical Parts List

9-11

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10. Flow Chart of Troubleshooting

Check the pins of UCD301

???

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Flow Chart of Troubleshooting

10-2

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Flow Chart of Troubleshooting

10-3

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Flow Chart of Troubleshooting

10-4

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

ZD302

10-7

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Flow Chart of Troubleshooting

10-1-4. LCD Display part

LCD display is abnormal

Check LCD connection and replace LCD

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

10-10

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

10-12

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Flow Chart of Troubleshooting

10-1-6. Speaker Part

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Flow Chart of Troubleshooting

CLK13M_WM

C140

10-14

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Flow Chart of Troubleshooting

10-15

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Flow Chart of Troubleshooting

10-1-7. Receiver Part

There is no sound from receiver.

Check UCD301

???

END

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Flow Chart of Troubleshooting

10-17

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Flow Chart of Troubleshooting

10-1-8. Camera part

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

10-20

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

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Flow Chart of Troubleshooting

10-2. RF

10-2-1. GSM900 RX

Continuous RX ON

RF Input : 62 CH

AMP : -50dBm

???

Check UCD301

10-25

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Flow Chart of Troubleshooting

10-26

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Flow Chart of Troubleshooting

10-2-2. GSM1800 RX

Continuous RX ON

RF Input : 62 CH

AMP : -50dBm

???

Check UCD301

10-27

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Flow Chart of Troubleshooting

10-2-3. GSM1900 RX

Continuous RX ON

RF Input : 62 CH

AMP : -50dBm

???

Check UCD301

10-28

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Flow Chart of Troubleshooting

10-2-4. GSM850 RX

Continuous RX ON

RF Input : 62 CH

AMP : -50dBm

???

Check UCD301

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Flow Chart of Troubleshooting

10-2-5. GSM850 / GSM900 TX

???YES

??? YES

Change PAM101

10-30

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Flow Chart of Troubleshooting

10-31

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Flow Chart of Troubleshooting

10-2-6. DCS1800 & PCS1900 TX

???YES

??? YES

Change PAM101

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Flow Chart of Troubleshooting

10-33

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11. PCB Diagrams

11-1

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PCB Diagrams

TP301

11-2

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12. Block Diagrams

12-1

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13. Reference data

13-1. Reference Abbreviate

AAC: Advanced Audio Coding.

AVC : Advanced Video Coding.

BER : Bit Error Rate

BPSK: Binary Phase Shift Keying

CA : Conditional Access

CDM : Code Division Multiplexing

C/I : Carrier to Interference

DMB : Digital Multimedia Broadcasting

EN : European Standard

ES : Elementary Stream

ETSI: European Telecommunications Standards Institute

MPEG: Moving Picture Experts Group

PN : Pseudo-random Noise

PS : Pilot Symbol

QPSK: Quadrature Phase Shift Keying

RS : Reed-Solomon

SI : Service Information

TDM : Time Division Multiplexing

TS : Transport Stream

13-1

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