DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
1.SAMSUNG Memory : K
2.DRAM : 4
3.DRAM Type
B: DDR3 SDRAM
4.Density
51 : 512Mb
1G : 1Gb
2G : 2Gb
4G : 4Gb
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
6. # of Internal Banks
3: 4 Banks
4: 8 Banks
5: 16 Banks
Speed
Temp & Power
Package Type
Revision
Interface (VDD, VDDQ)
# of Internal Banks
7.Interface ( VDD, VDDQ)
6 : SSTL (1.5V, 1.5V)
8.Revision
M: 1st Gen.
A: 2nd Gen.
B: 3rd Gen.
C: 4th Gen.
D: 5th Gen.
E: 6th Gen.
F: 7th Gen
G: 8th Gen
H: 9th Gen
9.Package Type
Z: FBGA
H : FBGA
J : FBGA
M: FBGA
10.Temp & Power
C : Commercial Temp.( 0??C ~ 85??C) & Normal Power
L : Commercial Temp.( 0??C ~ 85??C) & Low Power
Y : Commercial Temp.( 0??C ~ 85??C) & Low VDD(1.35V)
11.Speed
F7 :
F8 :
H9 :
K0 :
October 2009
* Note : 1.35V product is 1.5V operatable.
October 2009
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
3: x 8
4: x16
October 2009
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
* Note : 1.35V product is 1.5V operatable.
October 2009
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
* Note : 1.35V product is 1.5V operatable.
October 2009
October 2009
* Note : 1.35V product is 1.5V operatable.
October 2009
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
October 2009
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
* Note : 1.35V product is 1.5V operatable.
October 2009
5. RDIMM RCD Information
5.1RCD Identification in JEDEC Description in Module Label
5.2Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0
Made in
Korea
5.3RCD Information
- Example
October 2009
78 + 4Ball FBGA for 1Gb
October 2009
October 2009
96Ball FBGA for 2Gb
October 2009
78Ball DDP for 1Gb
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
82 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)
0.2 
A B
0.35 ?? 0.05
1.40 ?? 0.10
78Ball DDP for 1Gb
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
78 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)
0.2 M A B
0.35 ?? 0.05
1.40 ?? 0.10
October 2009
78Ball DDP for 2Gb
A
B
C
(Datum B) D
E
F
G
H
J
K
L
M
N
78 - ???0.45 Solder ball (Post Reflow ???0.50 ?? 0.05)
0.2 
A B
0.35 ?? 0.05
1.40 ?? 0.10
October 2009
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
N/A
(for x64)
ECC
(for x72)
1.270 ?? 0.10
5.00
3.80
1.50??0.10
2.50
Detail A
2.50 ?? 0.20
0.2 ?? 0.15
1.00
Detail B
October 2009
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
1.00 ?? 0.10
2X 4.00 ?? 0.10 
0.10
C A B
October 2009
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
5.00 
0.20 
??2.50
0.80 ?? 0.05
0.2 ?? 0.15
10.9 0.4
Detail C
2x 2.10 ?? 0.15
Register
Address, Command and Control lines
October 2009
Inside
0.4
Green Line : TIM Attatch Line
Reg. pedestal line
7.45
2. BACK PART
Outside
October 2009
4. DDR3 RDIMM ASS???Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
132.95 ?? 133.45
19 ?? 0.1
* Dimension Index
October 2009