DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage

BGY2016

UHF amplifier module

FEATURES

???26 V nominal supply voltage

???16 W output power into a load of 50 ?? with an RF drive power of ???20 mW.

APPLICATIONS

???Base station transmitting equipment operating in the 1805 to 1990 MHz frequency band.

DESCRIPTION

The BGY2016 is a three-stage UHF amplifier module in a SOT365A package with a plastic cap. It consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic AlN substrate.

QUICK REFERENCE DATA

RF performance at Tmb = 25 ??C.

PINNING - SOT365A

handbook, halfpage

MSA447

Fig.1 Simplified outline.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

handbook, full pagewidth

Fig.2 Test circuit.

List of components (See Figs 2 and 3)

Note

1. The striplines are on a double copper-clad printed-circuit board (RO5880) with ??r = 2.2 and thickness = 0.79 mm.

90

42

Dimensions in mm.

Fig.3 Printed-circuit board component layout.

MOUNTING RECOMMENDATIONS

To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than

0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly.

A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction.

The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to ???finger tight??? and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm.

Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be used up to a temperature of 250 ??C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap.

ESD precautions must be taken to protect the device from electrostatic damage.

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1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS

Short-form specification ??? The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition ??? Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information ??? Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

DISCLAIMERS

Life support applications ??? These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes ??? Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

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