INTEGRATED CIRCUITS

TDA1519

2 x 6 W stereo car radio power amplifier

GENERAL DESCRIPTION

The TDA1519 is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power package. The device is primarily developed for car radio applications.

??? AC and DC short-circuit-safe to ground and VP

QUICK REFERENCE DATA

PACKAGE OUTLINE

9-lead SIL-bent-to-DIL; plastic (SOT110B); SOT110-1; 1996 July 19.

Fig.1 Block diagram.

FUNCTIONAL DESCRIPTION

The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features:

???low stand-by current (< 100 ??A)

???low mute/stand-by switching current (low cost supply switch)

???mute condition.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Fig.2 Power derating curve.

DC CHARACTERISTICS (note 1)

VP = 14,4 V; Tamb = 25 ??C; unless otherwise speci???ed

Notes to the characteristics

1.All characteristics are measured using the circuit shown in Fig.4.

2.The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8,5 V to 18 V.

3.At 18 V < VP < 30 V the DC output voltage ??? VP/2.

4.Output power is measured directly at the output pins of the IC.

5.Frequency response externally fixed.

6.Ripple rejection measured at the output with a source impedance of 0 ?? (maximum ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz.

7.Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

8.Noise output voltage independent of RS (VI = 0 V).

Fig.3 Stand-by, mute and ON conditions.

Fig.4 Application circuit diagram.

D

D1

q

DIMENSIONS (mm are the original dimensions)

A2

E

c

Q

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our ???IC Package Databook??? (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 ??C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 ??C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 ??C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speci???cation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speci???cation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.